Capability: tungsten carries far higher tensile strength than carbon steel at equal diameter, so a finer wire still keeps breakage under control; the barrier is uniform diamond adhesion and low coating stress.
Key data: 24–30 µm, electroplated nickel-bonded diamond.
Typical use: PV wafer slicing where kerf loss and wafers per ingot drive cost.
For full specifications and company details, please visit the official standalone website.
https://en.dialine.xiangqishow.com/products/tungsten-diamond-wire/
https://en.dialine.xiangqishow.com/products/tungsten-diamond-wire/